Thermal Management
Thermal management and the cooling of semiconductor packaged components such as multi-chip package standard products and complex custom
System in a Package (SiP) technology is a key factor in successful design. Microsemi Power and Microelectronics Group utilizes multiple techniques to ensure our products meet the demanding environmental and thermal requirements, including
military temp ranges , of our customers’ applications:
- Pre- and post-layout thermal modeling to optimize thermal dissipation thru die position, material selection and pin / ball pattern placement
- Package construction: Thermal vias and balls; embedded heat sinks; added copper layers; enhanced seal ring and lid placement to match customer heat sink style
- Electrical component characterization over target temperature extremes
- Die and component selection with low power performance and operating features
- Selection/recommendation of thermal sink materials
We have done thermal analysis simulation correlation to actual devices, including stacked die technology and non-stacked die designs, to ensure the most accurate thermal data is provided to our customers.
