HOME PRODUCTS CAPABILITIES ABOUT US MEDIA CONTACT US CAREERS

CAPABILITIES
Semiconductor Packaging
Multi-Chip Packages
Information Assurance
System in a Package
Circuit Card Assembly
Certifications
Obsolescence Management
Supplier Relationships
Thermal Management
PCN, BOM Control, Source Control
Surface Mount Technology
Chip On Board
COTS Technology
Military Temp Memory
RoHS
 


Thermal Management

Thermal management and the cooling of semiconductor packaged components such as multi-chip package standard products and complex custom System in a Package (SiP) technology is a key factor in successful design. Microsemi Power and Microelectronics Group utilizes multiple techniques to ensure our products meet the demanding environmental and thermal requirements, including military temp ranges , of our customers’ applications:
  • Pre- and post-layout thermal modeling to optimize thermal dissipation thru die position, material selection and pin / ball pattern placement
  • Package construction: Thermal vias and balls; embedded heat sinks; added copper layers; enhanced seal ring and lid placement to match customer heat sink style
  • Electrical component characterization over target temperature extremes
  • Die and component selection with low power performance and operating features
  • Selection/recommendation of thermal sink materials

We have done thermal analysis simulation correlation to actual devices, including stacked die technology and non-stacked die designs, to ensure the most accurate thermal data is provided to our customers.

Product Checklist
NAND Flash BGA
Quick Reference Guide
Trrust-Stor
TI_OMAP
WEDC Technology Guide
1GByte DDR3 SDRAM

© 2012 White Electronic Designs. All rights reserved.