Thermal management and the cooling of semiconductor packaged components such as the multi-chip package (MCP) standard products and complex custom
System in a Package is a key factor in successful design. WEDC utilizes multiple techniques to ensure our products meet the demanding environmental and thermal requirements of our customers’ applications:
- Pre and post layout thermal modeling to optimize thermal dissipation thru die position, material selection and pin / ball pattern placement
- Package construction: Thermal vias and balls; Embedded heat sinks; Added copper layers; Enhanced seal ring and lid placement to match customer heat sink style
- Electrical component characterization over target temperature extremes
- Die and component selection with low power performance and operating features
We have done thermal analysis simulation correlation to actual devices including stacked die and non-stacked die designs to ensure the most accurate thermal data is provided to our customers.
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