Commercial Multichip Modules

WEDC is the leading supplier of high reliability commercial memory and microprocessor products in monolithic and Multichip Module Packages (MCP). Multichip Module Packages or Packaging is a method of providing tomorrow's products today. This is accomplished by designing multiple silicon die, mounted on a microcircuit laminate, within the confines of a defined molded package. From one-megabit monolithics to multi-gigabit modules, WEDC provides a variety of memory configurations utilizing ceramic, hermetic packages and plastic encapsulated microcircuits. Thus, providing the density and/or the organization required in many cases, a year or more prior to the monolithic replacement. Our product definitions provide for today as well as tomorrow's need without sacrificing quality, reliability or performance.

WEDC offers a wide range of screening options from commercial temperature to fully compliant, MIL-PRF-38534 and MIL-PRF-38535. Our high reliability devices are designed and tested to withstand the most extreme environments. These products are used in critical systems for airborne, missile, marine, satellite, radar, ordnance and electronic countermeasure applications. Our commercially viable MCP design process and services allows us to support the market with standard evolutionary memory product definitions. These semi-custom and full custom design services improve time-to-market, reduce design complexity and improve performance due to loading and inductive effects. Thus, leading to an inclusive lift of product solutions unmatched in quality, performance and flexibility by any other integration supplier or supplier service.

Custom Capability

Continual advances in high performance system requirements have created the need for increased integration of high-density electronics and high performance memory modules. Ruggedized subsystems offering reduced size, lower weight and improved electrical performance is the core of White Electronic Designs' custom MCP technology.

WEDC has the engineering resources; development capability and CAD support to design complex ruggedized MCPs. WEDC also has the required tools, materials and processes for assembly and test of these MCPs.

Module or Modular Solutions

Module or modular Solutions is a method of providing field replaceable or upgradeable products that follow the JEDEC standards for memory based products wherever applicable. JEDEC is a non-profit trade association, promoting standard based product guidelines.

Our time proven, wide-ranging high performance memory modules and memory plus product offering provides our customer base with cost effective solutions offered in asynchronous and synchronous SRAM technologies as well as synchronous DRAM and Flash memory chips. White Electronic Designs prides itself on its heritage of long-term product support, evidenced here in its product line. The module product line continues to support clients with products first manufactured in the late 1980's. Although wide ranging, our standard product offering, may not include your optimum device. Therefore, WEDC continues to support its module clients with custom design services.

PCMCIA Memory Card or PC-card Products

PCMCIA Memory Cards, sometimes referred to as PC cards, are credit card sized accessories, which facilitate the adding of memory or I/O functionality in a rugged compact form to computer platforms containing the PC card interface. This method and the products supplied via this platform follow the Personnel Computer Memory Card International Associations (PCMCIA) standard. This governing body is a non-profit international trade association and standards body that promotes interchangeable PC card technology.

Our PCMCIA product portfolio contains memory-based products within each of the following architectures; asynchronous SRAM, uniformed sectored Flash memory chips, and NAND based Flash and Controller. We offer the largest, all memory PCMCIA card product portfolio in the industry.