System in a Package

System in a Package (SiP) technology is a fully functional system or sub-system using advanced semiconductor packaging to optimize performance, size and cost. Typically it will contain two or more dissimilar die, i.e., the combination of a processor, gate array, RAM and NV memories can be combined with other components such as passives, filters, mechanical parts, voltage regulators, etc. These are assembled on an interposer or substrate to create a customized, highly integrated product for a specific application. Within the SiP technology, the designer can utilize bare die (wire bond or flip chip); FBGA/CSP packaged devices; stacked die; package-on-package, PBGA or hermetic packaging.

Multi-chip packages are lower cost standard functional blocks, typically memory, and make use of the established packaging and assembly infrastructure. Multi-chip packages can be viewed as standard single-chip packages, modified to accommodate the multiple ICs and passive components to provide the user with much higher density and integration.

Both system in a package (SiP) and multichip technologies own broad application opportunities across many market segments, including consumer electronics, mobile phones, automotive, computer, telecom and defense-aerospace. Microsemi Power and Microelectronics Group focuses their design, assembly and test resources on the defense-aerospace segment.

SiP technology in combination with BGA technology is viewed as part of the solution set for the gap between silicon I/O density and performance and the material capabilities of the package and board/substrate.

MPMG provides a one-stop, on-shore source for concept analysis, MCM design services, assembly and test of high density semiconductor packaging for the military and other mission critical market applications.

View our System in a Package (SiP) brochure .