HOME PRODUCTS CAPABILITIES ABOUT US MEDIA CONTACT US CAREERS

CAPABILITIES
Semiconductor Packaging
Multi-Chip Packages
Information Assurance
System in a Package
Circuit Card Assembly
Certifications
Obsolescence Management
Supplier Relationships
Thermal Management
PCN, BOM Control, Source Control
Surface Mount Technology
Chip On Board
COTS Technology
Military Temp Memory
RoHS
 


PCN, BOM Control, Source Control

Microsemi is actively engaged with a diverse cross-section of leading and emerging industries to identify the latest technology, research the best possible solution, develop innovative products, and disseminate best practices that leverage the opportunities of our dynamic and global economic business environment by providing:
  • Best access and vendor choices
  • Leading edge memory and proven solutions
  • Component obsolescence management
  • Bill of materials (BoM) control: product & revision management; choice of products
  • Lock BoM: systems that lock & control the entire bill-of-materials and firmware provide the assurance that you will get the same product each time you purchase it.
  • Product Change Notification (PCN): notification of all die, firmware & critical component changes and any variations that may adversely affect fit, form, function, quality or reliability
  • Source control; traceability. Serialization is available.
  • Risk mitigation: identify the risk; analyze the risk; communicate & expound available solutions with the customer
  • Evolving technology; end-of-life transitions; multiple suppliers
  • Engineering support: stepping forward to educate; share information; provide design options


Product Checklist
Quick Reference Guide
Trrust-Stor
TI_OMAP
WEDC Technology Guide
1GByte DDR3 SDRAM

© 2012 White Electronic Designs. All rights reserved.