It's STACKED

White Electronic Designs has developed a unique method of die stacking technology that utilizes our System in a Package (SiP) advanced semiconductor packaging. Our advanced microelectronic solutions not only free up board space and reduce I/Os, they also provide advantages in performance, integration, cost and obsolescence management. We are one of the foremost experts and microelectronics partners in constructing extended environment, high-reliability, high-density semiconductor packages. WEDC also offers full-service design, assembly and test module ruggedization with comprehensive risk mitigation for memory modules, and printed circuit board assembly.

What design challenge are you facing?	Multi-chip packages/System-in-a-Package Circuit Card Assembly Flip Chip Technology Semiconductor Package Testing Extended Temperature Plastics
	Required fields are in bold.
Full Name
Company Name
E-Mail
Tel
Need Additional Product Information?	Yes   No
	For validation, enter the characters shown above in the text box below.
Validation

Legal | Privacy | Site Map | Request Quote | Contact Us | Market Segments