Our surface mount technology and printed circuit board assembly services provide the latest technology capabilities and meet your expectations on quality, service and delivery. We provide complete assembly services, from concurrent engineering support on front-end design for manufacturing and testability to functional testing of finished printed circuit board assemblies.
Our surface mount technology assembly capabilities include:
- Chip Scale Packages (CSP)
- Thin Small Outline Package (TSOP)
- Plastic Leaded Chip Carrier (PLCC)
- Quad FlatPack (QFP)
- Fine-Pitch Ball Grid Array (FBGA)
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