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CAPABILITIES
Semiconductor Packaging
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Surface Mount Technology
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Military Temp Memory
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Surface Mount Technology

Our surface mount technology and printed circuit board assembly services provide the latest technology capabilities and meet your expectations on quality, service and delivery. We provide complete assembly services, from engineering support on front-end design for manufacturing and testability, to functional testing of finished printed circuit board assemblies.


Our surface mount technology assembly capabilities include:
  • Chip Scale Packages (CSP)
  • Thin Small Outline Package (TSOP)
  • Plastic Leaded Chip Carrier (PLCC)
  • Quad FlatPack (QFP)
  • Fine-Pitch Ball Grid Array (FBGA)
  • Flip Chip Die Attach



Product Checklist
NAND Flash BGA
Quick Reference Guide
Trrust-Stor
TI_OMAP
WEDC Technology Guide
1GByte DDR3 SDRAM

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