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CAPABILITIES
Semiconductor Packaging
Semiconductor Assembly
Semiconductor Test
Multi-Chip Packages
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System in a Package
Circuit Card Assembly
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Thermal Management
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Military Temp Memory
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Semiconductor Packaging Test

Microsemi Power and Microelectronics Group has extensive in-house test capabilities. Our engineers are experienced with advanced test hardware and software development and use. Hardware and software are developed internally based on the hardware platforms and product requirements of our customers. Software tools allow MPMG to fully characterize products by running Schmoo plots of parameters vs. supply voltage vs. temperature. Based on this information, we can test components for use over various temperature ranges, including military temperature.

MPMG designs and fabricates its own test hardware boards for characterization and production testing. We have extensive knowledge of standard off-the-shelf test sockets recommended for use. MPMG also designs and fabricates its own sockets for special use applications.

Environmental test chambers as well as full dynamic and static burn-in testing is used to ensure MPMG produces and ships the highest quality products to our valued customers.

Test software is written in C, C++, VISUAL BASIC, LabVIEW, and assembly language as required.

Product Checklist
Quick Reference Guide
Trrust-Stor
TI_OMAP
WEDC Technology Guide
1GByte DDR3 SDRAM

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