Semiconductor Packaging Test

We have extensive in house test capability. Our test engineers are experienced with advanced test hardware and software development and use. Hardware and software are developed internally based on the hardware platforms and product requirements of our customers. Software tools allow WEDC to fully characterize products by running schmoo plots of parameters vs. supply voltage vs. temperature. Based on this information, WEDC can de-rate components for use over various temperature ranges such as military temperature.

WEDC designs and fabricates its own load boards for characterization and production testing. WEDC has extensive knowledge of standard off-the-shelf test sockets recommended for use. WEDC also designs and fabricates its own sockets for special use applications.

Environmental test chambers as well as full dynamic and static burn-in testing is used to ensure WEDC produces and ships the highest quality products to our valued customers.

Test software is written in XENIX, C, BASIC, QTL proprietary language, and assembly language as required. All production test software is under Engineering Change Notification (ECN) control.