Semiconductor Packaging

We cater to the high-reliability original equipment manufacturer (OEM) by designing COTS and custom multi-chip package solutions for multiple applications. Our material and assembly costs meet the budget goals of extended environment designs.

Microsemi has the engineering resources and development capability to design complex ruggedized semiconductor packages, as well as providing complete design, assembly and test capabilities , while reducing risk and providing obsolescence management to our valued customers.

During the design phase, Microsemi engineers evaluate thermal, electrical and de-rating elements of the proposed product, including material compatibility as it pertains to TCE, Tg, moisture and adherence.

We use strict internal design guidelines for optimum manufacturing of ceramic and laminate boards and substrates based on years of experience in semiconductor packaging.

To facilitate these designs, we use:

Advanced design software and techniques
Thermal and mechanical analysis & emulation
Signal integrity analysis
IBIS or EBD modeling
Matched length routing
Thermal analysis
High-speed controlled impedance routing
Controlled capacitance and delay routing