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Defense Electronics Capabilities & Services
Semiconductor Packaging
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Semiconductor Packaging

To leverage the advances of Commercial-Off-The-Shelf memory (COTS) technology, we cater to the high-reliability original equipment manufacturer (OEM) market by designing multi chip module and custom multi-chip packages and solutions with multiple applications. Our die stacking, substrate and assembly costs meet the budget goals of extended environment designs.

White Electronic Designs has the engineering resources, development capability and CAD support to design complex ruggedized semiconductor packages. As well as providing complete design , assembly and test capabilities while reducing risk and providing obsolescence management to our valued customers.

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