We have the design and engineering resources, development capability and CAD support to design complex ruggedized multi chip package (MCP) assemblies. WEDC performs full interposer layout, design and analysis. During the design phase WEDC design engineers will evaluate thermal, electrical and de-rating elements of the proposed product, including material compatibility as it pertains to, TCE, Tg, moisture, and adherence.
We use strict internal design guidelines for optimum manufacturing of ceramic and laminate boards and substrates based on years of experience in semiconductor packaging.
To facilitate these designs, we use:
- Advanced design software and techniques
- Thermal and mechanical analysis & emulation
- Signal integrity analysis
- IBIS or EBD modeling (link to 6.2.2 Simulation Models)
- Matched length routing
- Thermal analysis
- High-speed controlled impedance routing
- Controlled capacitance and delay routing
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