Semiconductor Packaging Assembly
Microsemi Power and Microelectronics Group, an experienced electronic defense contractor, operates in a 110,000+ square foot office and manufacturing facility which encompasses die-based and SMT assembly. MPMG is DSCC certified for
MIL-PRF-38534 Class H and K , as well as MIL-PRF-38535 Class B assembly supported by MIL-STD-883 test methods.
The Company has a 15,000 square foot Class 100,000 clean room. Adjacent to the clean room are necessary support functions including document control, stock room, burn-in, environmentals and final QA. MPMG also has a DoD secure area for classified programs, where a product can go from concept to final test without having to leave the secure area. We produce prototypes and low volume, high mix assemblies necessary for the defense electronics market.
Our semiconductor assembly, memory device repackaging and manufacturing capabilities include:
- Automated high placement accuracy die and component pick-and-place capability
- Chip on board assembly
- Automated wire bonding to 35 mil pitch
- Gold and aluminum wire bonding
- Flip chip attach on 150 micron pitch
- Single or multi-dice packaging in BGA, CQFP, CPGA, CDIP, CSOJ, Flatpack and customer defined packages
- Die stacking technology
- MIL-STD-883 test methods
- Package-on-package assembly
- Multichip PBGA packaging
- Ceramic hermetic packaging in PGA, CQFP and other standard packages
- Automated epoxy attach (non-conductive and conductive)
- Conductive epoxy attach for low temperature substrates
- Plasma cleaning systems
- Reflow ovens with air or nitrogen capability
- Wafer dicing
- Seam seal capability
- X-ray analysis
- Automatic optical inspection
- C-SAM
- Conformal coating capability
- ESS systems
- Environmental testing
