Our Defense Microelectronics Division operates from a 110,000+ square foot office and manufacturing facility which encompasses die based assembly as well as SMT assembly. WEDC is DSCC certified for
MIL-PRF-38534 Class H and Class K , as well as MIL-PRF-38535 Class B assembly.
Within the Defense Microelectronics Division is a 15,000 square foot Class 100,000 clean room. Adjacent to this clean room are all necessary support functions including: document control, stock room, burn-in, environmentals and final QA. WEDC also has a secure area, where a product can go from concept to final test, without having to leave the secure area. Defense Microelectronics Division produces prototype, and quick turn assemblies necessary for the defense/aerospace market, as well as our high volume commercial off the shelf (COTS) catalog products.
Our assembly and manufacturing capabilities include:
- Automated high placement accuracy die and component pick-and-place capability
- Chip on board
- Automated wire bonding ¡Ü50 mils pitch
- Flip chip attach ¡Ü200 micron pitch
- Single or multi-dice packaging in BGA, CQFP, CPGA, CDIP, CSOJ, Flatpack and customer defined packages
- Die stacking
- Automated epoxy attach (non-conductive and conductive)
- Conductive epoxy attach for low temperature substrates
- Plasma cleaning systems
- Reflow ovens with air or nitrogen capability
- Wafer dicing
- Seam seal capability
- X-ray analysis
- Automatic optical inspection
- C-SAM
- Conformal coating capability
- ESS systems
- Environmental testing
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