Defense Microelectronics & Multichip Semiconductor Packaging

The Microsemi Power and Microelectronics Group in Phoenix provides standard and custom microelectronic products, semiconductor packaging and circuit card integration for mission critical defense applications where requirements include:

Enhanced memory & processor performance
Miniaturization
Extended environment operation
Long term reliability
Density, weight and height restrictions -- SWaP requirements
Embedded tamper resistance and information assurance
Obsolescence mitigation
Zero failure performance
Hermeticity

Our products solve key design challenges with advanced semiconductor packaging and memory device repackaging that leverage COTS technology to increase board density and reduce design complexity, while improving signal integrity. A variety of memory configurations utilizing plastic encapsulated microcircuits and ceramic, hermetic packages are available for industrial and military temp memory ranges. These products have extended environmental capabilities that ensure device performance over wide temperature, shock, and vibration excursion.

Microsemi also offers full-service design, assembly, tamper resistance and test processes with comprehensive risk mitigation for multichip products and surface mount card assembly. Benefits include:

COTS / MOTS devices
Roadmaps that provide an upgrade path to denser memory and logic
Second level reliability data
Thermal management
Mechanical analysis
Component selection and derating
Material selection
Leveraged advances in semiconductor technology
One on-shore trusted source for all assembly and test needs

Our integrated silicon and advanced packaging solutions are manufactured and tested in accordance with MIL-PRF-38534 Class H & K, and MIL-PRF-38535, created by DSCC to provide standardized fabrication, documentation and testing.

Member of:

JEDEC

Review the Defense Quick Reference Guide