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NAND BGA Package Provides Up to 16 GByte Solid State StorageHigh-Performance Compact Storage Alternative for Embedded ProductsPHOENIX, Ariz. (August 27, 2010) Microsemi Corporation’s (Nasdaq:MSCC) Power and Microelectronics Group now offers a high-density Single Level Cell (SLC) NAND solid state storage solution in a single integrated plastic ball grid array (PBGA) package. In 8 and 16 GByte densities, the 27mm x 22mm package offers a 63% space savings over a standard CF card of comparable density. The easy-to-integrate package consumes very little battery life when compared to hard drives and other larger form factor SSD solutions, yet provides high performing data rates.The BGA is designed specifically for use in the rugged and demanding environments of defense and aerospace applications, providing highly reliable data storage for embedded computing such as that used in aircraft, communications and missiles. The surface-mountable data storage device supports various PATA interface protocols, and an integrated 32-bit RISC flash controller manages wear leveling, error correction and power interruption protection. The PBGA package is constructed using eutectic tin-lead solder balls on a 1.27mm pitch with strategically placed signals to extend device life in harsh environments. Microsemi has full design, manufacture and test capabilities for a wide variety of MCPs, Commercial-Off-The-Shelf (COTS) memory, processors and combination MCPs for demanding applications at our US facilities. Additionally, these microelectronic products can be ruggedized and processed for tamper resistance. NAND BGA Datasheet download Product Flyer download More Solid State Storage Products from Microsemi High and low resolution product photos About Microsemi Power and Microelectronics Group – Phoenix Division (formerly White Electronic Designs Corporation) www.whiteedc.com Microsemi Corporation’s (Nasdaq:MSCC) Power and Microelectronics Group provides advanced technology solutions for the defense/aerospace electronics market. Our core strengths include our ability to deliver sophisticated multi-chip semiconductor products, high-efficiency memory devices and the miniaturization of defense embedded systems for a diverse set of OEM primes. The ability to address the unique size, performance and quality requirements for technology creators in the defense market has established Microsemi as the industry's customer-focused solutions provider. Capabilities include: turn-key design through production; manufacturing and obsolescence management for advanced embedded solutions; test qualification; miniaturization of existing designs; combining RF and digital onto one board; die stacking and information assurance technologies. To learn more, visit www.whiteedc.com. About Microsemi Corporation Microsemi Corporation, with corporate headquarters in Irvine, California, is a leading designer, manufacturer and marketer of high performance analog and mixed-signal integrated circuits, high reliability semiconductors and RF subsystems. The company's semiconductors manage and control or regulate power, protect against transient voltage spikes and transmit, receive and amplify signals. Microsemi's products include individual components as well as integrated circuit solutions that enhance customer designs by improving performance and reliability, battery optimization, reducing size or protecting circuits. The principal markets the company serves include implanted medical, defense/aerospace and satellite, notebook computers, monitors and LCD TVs, automotive and mobile connectivity applications. More information may be obtained by contacting the company directly or by visiting its website at http://www.microsemi.com. The Microsemi Corporation logo is available at http://www.globenewswire.com/newsroom/prs/?pkgid=1233 << Return to Newsroom
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