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WEDC Launches NAND SSD Product LineRugged, Reliable Data Storage in Densities up to 4GBytesPhoenix, May 26, 2009 White Electronic Designs Corporation (NASDAQ:WEDC) has introduced a surface mountable data storage device that is specifically designed for use in the rugged and demanding embedded environments of defense and aerospace applications. The product is available in 1, 2 and 4 GByte densities in a 22mm x 27mm plastic ball grid array (PBGA) package and supports various PATA interface protocols. This product provides highly reliable high-density data storage for embedded computing, such as that used in aircraft, communications and missiles.“These products were engineered specifically for the defense market, with features designed to ensure data reliability in mission critical rugged and mobile systems. As a natural extension of our MCP and SiP technologies, these devices bring big features in a miniaturized package,” stated Mark Downey, Director of Defense Technology. “This is really just the beginning of more to come from us in the storage area. We are listening to what our defense customers want from a solid state storage provider and plan to deliver on those requirements with commitment and focus.” Constructed using a 32-bit RISC processor as its core storage controller, this SSD provides all the important Flash management techniques for delivering a highly reliable solution. Incorporated wear leveling and error correction techniques extend disk operating life. The device provides data protection in the event of a sudden unplanned power loss or disturbance and can operate from a single 5-volt or 3.3-volt power supply. Constructed using Single Level Cell (SLC) NAND-based storage technology, it delivers significantly higher performance than the many other embedded form factor SSDs being produced by the general market. SLC Flash-based solutions provide approximately ten times more write/erase cycles than those with Multi Level Cell (MLC) Flash devices, thus resulting in the further extension of disk life performance. The PBGA package is constructed using eutectic tin-lead solder balls on a 1.27mm pitch with strategically placed signals to extend device life in harsh environments. It supports ATA/PCMCIA 2.1, compact flash 3.0 and 4.0 compliant interfaces. Additionally, the PBGA saves 150mm2 board space compared to an equivalent discrete design. WEDC has full design, manufacture and test capabilities for a wide variety of MCPs, Commercial-Off-The-Shelf (COTS) memory, processors and combination MCPs for demanding applications at our US facilities. Additionally, these microelectronic products can be ruggedized and processed for tamper resistance. About White Electronic Designs Corporation | www.whiteedc.com White Electronic Designs (NASDAQ: WEDC) delivers sophisticated multi-chip semiconductor products, high-efficiency memory devices and build-to-print electromechanical assemblies for defense and aerospace applications. The ability to address the unique size, performance and quality requirements for technology creators in the defense market has established White Electronic Designs as the industry's customer-focused solutions provider. Capabilities include: turn-key design through production; manufacturing and obsolescence management for advanced embedded solutions; test qualification; miniaturization of existing designs; combining RF and digital onto one board; die stacking and information assurance technologies. To learn more, visit www.whiteedc.com. Media Contact: Nikki Myers 602.437.1520 ext. 181 nmyers@wedc.com << Return to Newsroom
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