High-Efficiency Markets Drive Demand for Complex Circuit Card Assemblies

WEDC assemblies fit defense and aerospace trends calling for density and performance increases on decreasing board space

Phoenix, Arizona - September 2, 2008 – White Electronic Designs Corporation (NASDAQ:WEDC) anticipates an expansion in the market for complex circuit card assemblies driven by size, weight, and power requirements. Faster, smaller and better circuit cards for high-efficiency applications such as missiles, ordnance, unmanned aerial vehicles and secure communications systems are in demand. As a result, engineers, developers and system integrators seek new and innovative approaches to solving design challenges for these mission-critical applications.
“Global positioning system (GPS) receivers that used to be on a 15in2 board in handheld communications systems are now being challenged to be incorporated on a board that is one-fifth that size for use with additional capabilities, including locate and rescue operation features, longer battery life and more lightweight,” notes BJ Heggli, Vice President of Engineering, White Electronic Designs Corporation (NASDAQ:WEDC). “Engineers will need to address this complex challenge from both the design and component levels to meet the circuit card size and density specifications.”
One option for meeting miniaturization and density specifications comes in the form of an advanced multichip module (MCM) or system-in-a-package (SiP). SiP is a functional sub-system using advanced semiconductor packaging. It typically contains two or more dissimilar die, i.e., the combination of a processor, gate array, RAM and NV memories can be combined with other components such as passives, filters, mechanical parts, voltage regulators, etc. SiP in combination with BGA (ball grid array) technology is viewed as part of the solution set for the gap between silicon I/O density and performance and the material capabilities of the package and board/substrate.
White Electronic Designs specializes in the design, development and delivery of comprehensive circuit card assemblies for space-constrained applications. WEDC’s expertise includes production management for circuit card miniaturization projects with extensive experience in designing, fabricating and testing, as well as working with off-the-shelf test and custom designed sockets. Capabilities include high-end fine pitch BGA assembly and inspection, as well as assembly technology for COB, CSP, BGA, SM or connectors on the same circuit card. WEDC’s in-house design and development engineering team supports build-to-print or design-to-specification projects through the use of established and documented processes that assure reliability and production efficiency. Process control elements include material traceability, solder paste height & coverage, reflow oven characterization & control, test results tracking and ionic contamination testing.

About White Electronic Designs Corporation | www.whiteedc.com
White Electronic Designs (NASDAQ: WEDC) delivers sophisticated multi-chip semiconductor packages, high-efficiency memory devices, enhanced flat panel display systems and build-to-print electromechanical assemblies for defense, aerospace, high-performance computing and industrial applications. The ability to address the unique size, performance and quality requirements for technology creators in diverse market segments has established White Electronic Designs as the industry’s customer-focused solutions provider. Capabilities include design, manufacturing and obsolescence management for advanced embedded component solutions, including die stacking and secure microelectronics, as well as complex circuit card assembly services. Headquartered in Phoenix, Arizona, White Electronic Designs operates world-class development and production centers in Arizona, Indiana, Oregon and China.



CONTACT:
Lytham Partners, LLC
Joseph Diaz, Jr.
602-889-9700
diaz@lythampartners.com


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