HOME | COMPANY | CAREERS | INVESTORS | REQUEST QUOTE | ASK A QUESTION | CONTACT US
PRODUCTS | CAPABILITIES | MARKET SEGMENTS | MEDIA CENTER | KNOWLEDGE BASE
Newsroom| Events| Video Product Album| Photos

MEDIA CENTER
Newsroom
News Archives
Events
Video Product Album
Photos
 


WEDC Launches 1GB and 2GB FBDIMM Products

Phoenix, AZ—October 16, 2006—White Electronic Designs Corporation (NASDAQ:WEDC) today announces the release of its 1GB and 2GB Fully Buffered DIMM (FBDIMM) products. These products support 533 and 667 MHz DDR2 DRAM on-DIMM data rates while operating up to 4.0 Gb/s serial data transfer over multiple serial links at the card edge. WEDC is also targeting the release of a 4GB density module in the first quarter of 2007 and has plans to expand the product offering further as component technology becomes available.

WEDC’s FBDIMM modules feature a Full Metal Heat Spreader (FMHS) option for improved thermal performance. Constructed using x4 DDR2 memory components, these products are compatible for use with the industries best system level ECC software algorithms.

FBDIMM technology is a perfect match for many high performance computing applications, such as the enterprise market. These applications require performance, reliability and overall bus density, of which FBDIMM technology was designed to address. By moving from the conventional parallel bus architecture to the new high speed “point-to-point” serial interface, this technology moves the system board closer to total serialization. FBDIMM provides both expanded density and bandwidth while at the same time reducing system board layout complexity. Targeting improved system reliability, availability and serviceability makes this product family an ideal solution for enterprise designers.

WEDC’s investment in test hardware and software equipment provides the backbone for its test validation program. This in-house program is used to qualify new designs, sourcing changes and other changes that could prevent continuous production flow. Production testing includes 100% testing of modules at speed and across both temperature and voltage corners.

Density Serial Link Speed DRAM Speed WEDC Part Number
1GB 3.2Gb/s 533Mhz W3HG128M72AEF534F1SAG
1GB 4.0Gb/s 667Mhz W3HG128M72AEF665F1SAG
2GB 3.2Gb/s 533Mhz W3HG2128M72AEF534F1SAG
2GB 4.0Gb/s 667Mhz W3HG2128M72AEF665F1SAG

Pricing and Availability
Contact factory for pricing of specific part numbers and lead times.

Product Photo
To download high and low resolution photos go to: http://www.wedc.com/mediaphoto

About White
White Electronic Designs Corporation designs, develops and manufactures innovative solutions for military, industrial and commercial markets; advanced semiconductor packaging, high-density memory products and state-of-the-art microelectronic multi-chip modules for data communications and telecommunications providers, defense and aerospace system suppliers; LCD panels and ruggedized displays for commercial/military aircraft and ordnance delivery systems; designs and manufactures membrane and elastomer keypads, medical sensors and RFID antennae; and electromechanical assemblies for OEM's in commercial and military markets. White is headquartered in Phoenix, Arizona and has design and manufacturing centers in Arizona, Indiana, Oregon and Ohio. To learn more about White Electronic Designs, visit our web site at www.wedc.com.



<< Return to Newsroom

Legal | Privacy | Site Map | Request Quote | Contact Us | © 2008 White Electronic Designs