WEDC Announces High Reliability Multi-Chip Package Product Line Expansion

Phoenix, AZ—April 28, 2006—White Electronic Designs Corporation (NASDAQ:WEDC) is pleased to announce its latest DDR2 SDRAM PBGA Multi-Chip Package (MCP). The SDRAM is organized as 32M x 64, packaged in a 20 x 16mm, 320mm², 208 plastic ball grid array (PBGA). This package is suitable for high-reliability applications and is available at data rates of 400, 533 and 667 Mbs in commercial, industrial and military temperature ranges.

Benefits include a 62% space savings versus fine pitch ball grid array (FPBGA), 42% I/O reduction versus FPBGA, reduced trace lengths for lower parasitic capacitance and reduced part count. It delivers high density for increased performance. It is also upgradeable to 64M x 64 density (Contact factory for future availability information).

WEDC’s new DDR2 SDRAM MCP features internal pipelined double-data-rate (DDR) architecture enabling two data accesses per clock cycle. The SDRAM provides programmable Read or Write burst lengths of 4 or 8, four internal banks allow concurrent operation and it features differential data strobe (DQS, DQS#) per byte for transmitting and receiving data.

Pricing and Availability
White’s 32M x 64 DDR2 SDRAM MCP, designated as part number W3H32M64E-XSBX, is priced at $200.00 (US) each in volumes of 1,000 pieces with a lead-time of 6 weeks.

Product Photo
To download high and low resolution photos go to: http://www.wedc.com/mediaphoto

About WEDC
White Electronic Designs Corporation designs, develops and manufactures innovative solutions for three high technology sectors in military, industrial and commercial markets; advanced semiconductor packaging, high-density memory products and state-of-the-art microelectronic multi-chip modules for data communications and telecommunications providers, defense and aerospace system suppliers; ruggedized high-legibility flat panel display for commercial/military aircraft and ordnance delivery systems; interface storage and retrieval devices, and electromechanical assemblies for OEM's in commercial and military markets. WEDC is headquartered in Phoenix, Arizona and has design and manufacturing centers in


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