We work diligently to reduce risk associated with obsolescence for our valued customers. A key concern with the general use of semiconductor devices is the availability of die, die revisions or die EOL. We endeavor to:
- Create and maintain direct relationships with major US semiconductor suppliers their distributors
- Monitor suppliers and die-EOL situations closely to insure source of supply
This approach to obsolescence management and risk mitigation allows us:
- The ability to access a wide range of dice types from existing inventory used on hundreds of WEDC standard products
- Dice / material acquisition and secure bonded inventory capability
- Low volume / MOQ requirements
Besides these die vendor relationships, we also maintain close relationships with key board and package suppliers as we continue to push our product and package development strategies.
The combination of supplier relationships and in-house expertise in
design ,
assembly and
test we can manufacture single or multi-die packages to match existing and backward compatible package or pinout requirements while utilizing the most recent and advanced die and package technologies available.
|
