Obsolescence Management

A major consideration for both components and an overall systems design approach is obsolescence management. Obsolescence in component materials as well as the physical dimensions of the component can have a dramatic impact on the long-term viability of a product lifecycle. Both are critical in the design and development of products for the defense and aerospace industries where aircraft, missile and C4ISR systems require long-term reliability and upgradability.

Embedded electronics in applications such as missile, ordnance, and aircraft platforms continue to require increased processing and performance power without an increase in electronic component volume. Technology creators use a variety of obsolescence management techniques that can be categorized as either production engineering-based techniques (that attempt to control an existing situation) or design-based techniques (that attempt to minimize the initial problem). Both of these obsolescence management techniques have potential disadvantages, whether it be the potentially prohibitive cost of finding component EOL-buys or the possibility of introducing unforeseen problems with more up-to-date products. Based on the circumstances of a particular program or product application, it is possible to combine these techniques to achieve the optimum results.

We work diligently to reduce risk associated with obsolescence for our valued customers. A key concern with the general use of semiconductor packages is the availability of die, die revisions or die EOL. To help with obsolescence management, we endeavor to:

Create and maintain direct relationships with major US semiconductor suppliers and their distributors
Monitor suppliers and die-EOL situations closely to insure source a continuous of supply
Offer creative inventory solutions to support legacy silicon requirements

This approach to obsolescence management and risk mitigation allows us:

The ability to access a wide range of dice types from existing inventory used on hundreds of Microsemi standard defense electronics products
Dice / material acquisition and secure bonded inventory capability
Low volume / MOQ requirements

Besides these die vendor relationships, we also maintain close relationships with key board and package suppliers as we continue to push our product and package development strategies.

With the combination of supplier relationships and in-house expertise in design , assembly and test, we can manufacture single or multi-die packages to match existing and backward compatible package or pinout requirements while utilizing the most recent and advanced die stacking and semiconductor package technologies available.