HOME PRODUCTS CAPABILITIES ABOUT WEDC INVESTORS MEDIA CONTACT US CAREERS

PRODUCTS
Defense Electronics & Services
Electromechanical Products
Knowledge Base
Die Stacking
Electromechanical Assembly
Speed Reducers
 


Products - Rugged Displays, Electromechanical Assembly, Flip Chip, Multi Chip Modules, Industrial Keypads from White Electronic Designs

Innovative Technology from WEDC

Multichip module products work in combination with BGA technology to create a solution set for the widening gap between silicon I/O density and performance, and the material capabilities of the package and board/substrate. These products are akin to single-chips that are modified to accommodate the multiple ICs and passive components, which provide the user with higher functionality integration. Most multichip module solutions are packaged in conventional LGA, BGA, CGA, QFP, PGA, or PLCC.

Multichip Module Packages

The multichip module package (MCP) offers several advantages, including:

  • Increased density and performance, as well as reduced size and weight at the board or system level
  • Incorporation of different interconnection technologies into the module is easily accommodated
  • Reduced board area and next-level routing complexity
  • The ability to incorporate stacked die or multi-level two-sided packages further increase density
  • Enables the OEM to upgrade products by using die-shrinks in the same package

To learn more about multichip module technology from WEDC, please contact us today.

WEDC & the Multichip Module Market

A successful provider of multichip module packages must have reliable connections to industry-leading vendors. WEDC has relationships with silicon suppliers of processors, memories, and logic. On the other side of the equation, WEDC also has strong ties to leading package and material vendors. WEDC began building multichip module solutions in 1987. We've been at the forefront of multi-chip module technology ever since. At the core of our MCP technology are ruggedized subsystems offering reduced size and weight and improved electrical performance.

More from WEDC

In addition to providing multichip module solutions, White Electronic Designs provides electronic contract manufacturing services to a number of industries. Products and services offered by WEDC include:

  • High-Performance Memory Modules
  • Mechanical Counters
  • Electromechanical Assembly
  • Circuit Card Assembly
  • And More

Learn more about service and product innovations from WEDC. From high-performance memory modules which serve as cost-effective, space-saving solutions, other memory card solutions for when ruggedization and reliability are crucial, to sophisticated multichip module offerings for greater functionality, White Electronic Designs is your source for innovative solutions.

Contact WEDC today for answers to your product and service inquiries, as well as for pricing and ordering information.



WEDC Upcoming events
Quick Reference Guide
Guardian
WEDC Technology Guide
Gbyte DDR2 SDRAM

© 2010 White Electronic Designs. All rights reserved.