Custom Memory Multi-Chip Packages (MCP) and Systems in a Package (SiP)

Microsemi Power and Microelectronics Group is a leader in memory solutions and a developer of multi-chip packaging, providing high density, high performance, custom multi-chip packages (MCPs) and Systems in a Package (SiPs). With versatile memory products, MPMG can provide very high density in a very small space by using available MCP and SiP technology.

Our custom multi-chip packages can be viewed as standard single-chip packages modified to accommodate the multiple ICs which provide the user with much higher density and integration. Most MCPs typically incorporate two to nine die and are packaged in conventional BGA, CGA, QFP, PGA, or PLCC. MCPs are available with DDR2, DDR, SDRAM, SRAM and flash technologies in a variety of densities and organizations.

SiP is a functional system or sub-system assembled into a single package. It typically contains two or more dissimilar die. MPMG provides a one-stop, on-shore source for concept analysis, design, assembly, anti-tamper and test of high-reliability SiPs for defense-aerospace. MPMG offers a family of standard COTS, SDRAM, DDR, DDR2, DDR3, Flash, and SRAM in PBGA and ceramic packages.

Both SiP and multi-chip technologies own broad application opportunities across various market segments.

For more information, please view our System in a Package (SiP) brochure .