Memory Device Repackaging - Semiconductor Package Assembly

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Semiconductor Package Assembly

Creating more space where none is to be found could be seen as an exercise in futility. WEDC thinks otherwise. By designing and manufacturing multi chip module and multi chip package solutions with multiple applications, we are able to leverage the evolution of commercial-off-the-shelf (COTS) advances to use die repackaging techniques in creating smaller and more efficient semiconductors to install where before it wasn't possible. WEDC engineers memory device repackaging for defense applications that optimizes space and weight while still maintaining a balance between form and function. By utilizing our system in a package (SiP) technology, we are able to create functioning systems and subsystems into one package. Semiconductor package assembly with WEDC means solving the question with more advanced and more innovative answers.

WEDC has the engineering resources, development and design capability to create complex, ruggedized semiconductor packages and provide complete design, assembly, and test phases related to memory device repackaging all while simultaneously reducing risk and providing obsolescence management to our customers. To ensure all products meet the budget goals and design specifications of our customers, WEDC is a company that tracks and manages every step between discussion and distribution. Begin browsing WEDC today to learn more about the opportunities of memory device repackaging and our robust die stacking technology.

System in a Package (SiP)

Optimizing space and weight does not mean sacrificing a semiconductor or module's functionality or capabilities. WEDC's SiP design has the capacity to not only reconfigure a device's construction, but scale and enhance it to fit on a smaller piece of the board or wafer it sits on. By utilizing two or more dissimilar die, we can create functional systems and subsystems in one complete package. This allows for greater functionality in a time-to-market window and increases density and performance while simultaneously decreasing size and weight. Our memory device repackaging technology includes many forms of microelectronics such as high density memory packages and advanced, self-contained multi and system in a chip modules.

Memory Device Repackaging Design, Assembly and Testing

All of our memory device repackaging systems undergo rigorous design, assembly, and testing phases in order to ensure our customers receive exactly what they designed in the exact budget in which they specified.

Semiconductor Design: WEDC performs full interposer layout, design, and analysis. During the design phase, our engineers analyze thermal, electrical, and de-rating elements of the proposed product. This includes material compatibility in reference to TCE, Tg, moisture, and adherence. We use strict internal design guidelines for optimum manufacturing of ceramic and laminate boards and substrates based on years of experience in semiconductor packaging.

Semiconductor Package Assembly: WEDC's Defense Microelectronics Division is a 15,000 square foot Class 100,000 clean room, adjacent to which are all the necessary support functions including burn-in, environmental, and final QA. Some of our memory device repackaging assemblies include: automated high placement accuracy die and component pick-and-place capability, flip chip attach ¡Ü200 micron pitch, seam seal capability and much more.

Semiconductor Testing: Testing software and hardware is developed in-house by our test engineers and each is based on the hardware platforms product requirements of our customers. WEDC fabricates and designs our own load boards for characterization and production testing. We have extensive knowledge of standard off-the-shelf test sockets that are recommended for use. WEDC also engineers its own sockets for special use applications. Full dynamic, static burn-in testing and environmental test chambers helps ensure WEDC designs, assembles and tests only the highest quality memory device repackaging products ready for shipment to our customers.

WEDC: Balancing the Needs of Today with the Expectations of Tomorrow

White Electronics has been a leader of technological innovation in developing high reliability memory device modules for over 50 years. Our capabilities allow us to serve customers from every spectrum of semiconductor use from aerospace and defense. WEDC's prides itself on providing the customer with full configuration control of their product which allows us to track and manage every step between discussion and distribution.

Please feel free to browse our site or more information on our memory device repackaging capabilities. For more information regarding design or assembly of WEDC's products, please contact us for more information by email or phone.