Leveraging our deep military heritage and disciplined manufacturing processes, we have the capability to support your most demanding hi-performance memory module testing requirements at whatever the level of support you require.
Long-term system reliability is our major focus for our customer's high performance computing systems. The reliability that is required is achieved by ensuring that the memory module is designed, manufactured and tested accurately. Our microelectronics divisions have extensive experience and capability in extended temperature testing. We can provide guard-banded extremes of temperature and voltage as well as temp-cycle simulations. Our typical hi-performance memory module test flow includes:
- Four-corner production test
- Min-max voltage and temp (0-70°C); guard band test
- temps to ±10°C
- Contact and leakage
- Operating Current
- Walk Shift Patterns
- March G
- Walk increment
- March X, Y, C
- Stress test
- SPD
On request, we can provide component revision tracking/control, configuration control or module design revision tracking/control.
Our part numbering system incorporates silicon supplier source control. Serialization and lot traceability are also available.
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