WEDC’s families of PowerPC with integrated SSRAM for L2 Cache Multi-Chip Packages (MCPs) are designed to give our customers an optimized high speed processor with a maximized L2 Cache density solution.
Utilizing the 755 and 7410 processors with between 1-2MB of SSRAM these MCPs provide a great deal of space savings versus the individually packaged parts, while providing reduced I/O count, reduced part and placement quantity and extended temperature availability at industrial and military temperature ranges.
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PowerPCTM System Solutions
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| Organization |
Part Number |
Speed |
Volt |
Package |
PDF |
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WED3C755E8M-XBHX |
300-350 MHz |
2.0 |
255 HBGA |
Datasheet Flyer
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WED3C755E8MF-XBX |
300-350 MHz |
2.0 |
255 CBGA |
Datasheet
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WED3C755E8MC-XBX |
300-350 MHz |
2.0 |
255 CBGA |
Datasheet
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WED3C7410E16M-XBX |
400 MHz |
1.8 |
255 CBGA |
Datasheet Flyer
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WED3C7410E16M-XBHX |
400 MHz |
1.8 |
255 HBGA |
Datasheet Flyer
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WED3C7410E16MC-XBHX |
400-450 MHz |
1.8 |
255 HBGA |
Datasheet
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