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Our family of DDR2 SDRAM based Multi-Chip Packages (MCPs) are designed to give our customers a high density memory solution that also meets the wide data widths necessary for their applications. These high speed memories use a 4ns-prefetch architecture with an interface that allows two data words to be transmitted per clock cycle.

With densities up to 1Gbyte in x64 and x72 data width configurations, these DDR2 memories provide many benefits, such as: space savings versus single die packages, including CSPs; reduced I/O routing; reduced component count and placements; and extended temperature range testing, including industrial and military.


DDR2 SDRAM
Organization Part Number Speed Volt Package PDF
32Mx64 W3H32M64E-XSBX 400-667 Mbs 1.8 208 PBGA Datasheet
32Mx72 W3H32M72E-XSB2X 400-667 Mbs 1.8 208 PBGA Datasheet
64Mx16 W3H64M16E-XBX 400-667 Mbs 1.8 79 PBGA Datasheet
64Mx64 W3H64M64E-XSBX 400-667 Mbs 1.8 208 PBGA Datasheet
64Mx72 W3H64M72E-XSBX 400-667 Mbs 1.8 208 PBGA Datasheet
128Mx72 W3H128M72E-XSBX 400-667 Mbs 1.8 208 PBGA Datasheet

DDR2 SDRAM Single-Rank
Organization Part Number Speed Volt Package PDF
32Mx64 W3H32M64EA-XSBX 400-667 Mbs 1.8 208 PBGA Datasheet

Registered DDR2 SDRAM
Organization Part Number Speed Volt Package PDF
128Mx72 W3H128M72ER-XNBX 400-667 Mbs 1.8 255 PBGA Datasheet


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