Die Stacking - Advanced Stacked Die Technology from WEDC

Products - Rugged Displays, Electromechanical Assembly, Flip Chip, Multi Chip Modules, Industrial Keypads from White Electronic Designs

Stacked Die Technology

With ever increasing advances in technology, smaller and more compact packaging systems are becoming more and more useful and important in the field of microelectronics. WEDC has developed a unique method of die stacking technology that utilizes our System in a Package (SiP). By optimizing both space and weight, WEDC continually strives to develop stacked die technology that adapts to and leverages the evolution of newer and more demanding technology. By stacking two or more dissimilar die, WEDC can design and assemble semiconductor packages that can operate at increased functionality for less cost. These packages and multichip systems offer application opportunities across many market segments, including consumer electronics, automotive, medical, defense-aerospace and more. WEDC specializes in focusing this new stacked die technology in the defense-aerospace, data communication, and high-end computer markets.

White Electronics has been developing and engineering microelectronics for aerospace and defense applications for over 30 years. From high density memory packages to advanced, self-contained multi and system-in-a-chip models, WEDC strives to create only the highest quality products for our customers. Begin browsing now to learn more about all of WEDC's die stacking technologies and applications.

Advanced Die Stacking Solutions

Balancing our System in a Package (SiP) designs with the increasing technological demands of defense markets has pushed WEDC to create newer and more innovative methods of die stacking technology. The two dissimilar die of the SiP production, a combination of a processor, gate array, Ram and NV memories with passives, filters or mechanical parts create a functional system or subsystem in one dynamic package and are combined to optimize both space and weight. This provides for greater functionality in a time-to-market window, and increases density and performance while at the same time minimizes the size and weight of the packaged semiconductor.

This type of die stacking technology of multichip packages are lower cost functional blocks, normally memory, that utilize the established packaging and assembly infrastructure. Multichip systems can be viewed as single-chip packages, adapted to incorporate multiple IC's and passive components that provide the user with higher integration and density.

Stacked Die Applications

The goals and limitations of products and designs vary by many degrees. When processing performance is limited due to printed circuit board space, our manufacturing capabilities provide for increased performance while simultaneously providing an upgraded path to more dense memory configurations. Many customers select our multi chip modules specifically for that reason alone.

As technology grows the products of that technological evolution become smaller and more efficient. At WEDC, we design and assemble robust semiconductor packages and microelectronics to parallel technology's growth and application designs. We are an industry leader in constructing highly dependent, extended life, high density semiconductor packages that include die stacking. These packages are then used for many types of enterprises including mission-critical defense applications. An additional advantage of die stacking is the simplification of surface-mount pc-board assembly because of the reduction of components taking up valuable board real estate.

WEDC provides full-service design, assembly, and test module ruggedization for memory modules and printed circuit boards. These high density memory devices limit size and weight but offer a more dynamic point of view, creating elegant and efficient die stacking interactions at a lower cost and improved functionality. Die stacking memory chips may now involve six or more chips of varying function or technology, including analog, logic, or mixed signal to name a few. Die stacking is also now synonymous with 'vertical integration,' the integration of circuits in vertical fashion to make the most of space and optimize efficiency for every single multichip module. WEDC's wide-ranging high performance memory modules provide our customers with cost effective solutions that come packaged in both asynchronous and synchronous SRAM technologies and DRAM and Flash memory chips.

With the ability to adapt quickly at any point in all of our customer's designs, WEDC develops devices and electromechanical assemblies that utilize die stacking technology to maximizes investment while minimizing risk. We have the flexibility to meet engineer's print requirements and design specifications, and by harnessing the layered properties of stacked die technology, we are able to create enhanced products that take the traditional COTS technologies to a higher and more complex level.

Less is More at WEDC

WEDC is an industry leader in providing aerospace, and defense products that leverage COTS technologies with enhanced semiconductor and multichip packages. Our die stacking technology builds high density devices while reducing the space and size needed to create efficient and cost effective products. For more information on any of our products contact as via email or call us directly by phone at 1.602.437.1520. To find more about how your die stacking project requirements can be met by any of our advanced microelectronics solutions, request a quote online. Start browsing all of our capabilities and our unique die stacking technology right now.