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 As a global provider of advanced embedded components for defense markets and applications including extended environment operational requirements, WEDC is Defense Microelectronics Activity (DMEA) accredited and a trusted source. WEDC offers full design, fabrication, and test capabilities for simple to complex custom Multi-Chip Packages (MCPs), Commercial-Off-The-Shelf (COTS) memory, processors and combination MCPs for demanding defense applications. Memory products include DDR3 SDRAM, DDR2 SDRAM, DDR SDRAM, SDRAM, SSRAM, SRAM, Flash, and EEPROM which can be ruggedized and processed for tamper resistance. WEDC delivers quality through procedures, policies, documentation and continuous improvement:
With more than 40 years of technology excellence and innovation White Electronic Designs provides an established, stable source for defense grade microelectronics packaging requirements. All packages include tin-lead interconnect. WEDC’s electronic contract manufacturing and defense electronics services include surface mount assembly, ball grid array, Flip Chip and chip on board assembly and test. WEDC’s manufacturing is an on-shore/DoD secure facility. Products are manufactured and tested in accordance with MIL-PRF-38534 Class H & Class K certification.
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