At WEDC, we combine the talent of engineers and designers with a quality manufacturing process to provide defect-free, on-time delivery at a competitive price. Our Phoenix manufacturing and design team offers electronic contract assembly of printed wiring boards and the following services:
Circuit Card Assembly
We provide circuit card assembly services for leading-edge surface mount and through-hole designs that can be customized to your specifications. Technologies include ball grid array, QFP, and chip scale package. Specifications: IPC-A-610 Class 2 or 3, J-STD-001 and MIL-STD-2000.
WEDC meets your specific requirements for low-to-high volume runs in our ISO 9001:2001 registered manufacturing facility, as well as AS9100A for DoD, NASA and Aerospace Programs.
Microelectronics Assembly
We provide custom assembly of multi chip module packages with memory, processor, PLD and other chips in a clean room environment to
MIL-PRF-38534/38535 .
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