Circuit Card Assembly

Microsemi Power and Microelectronics Group’s circuit card manufacturing capability is specifically targeted for the development of high-mix boards in low-to-medium volumes for the defense and aerospace industries. Operator training and certification, equipment selection, and process development are targeted to achieve the versatility necessary to produce experimental prototypes, pre-production orders and full production. We offer a comprehensive array of services, including:

IPC 610 Class 3 circuit card assembly
Design, test and assembly
Circuit board schematic and layout design
Component selection
Combination surface mount (SMT) and chip-on-board (COB)
On-shore development
Turn-key product assembly

We are skilled at high-end fine pitch SMT assembly and inspection, as well as assembly technology of COB, CSP and BGA. We can also perform rework, if necessary. Our experienced in-house design and manufacturing engineering team can support build-to-print or design-to-specification projects through the use of well-defined and documented processes which alleviate production concerns and enhance reliability.

Our extensive knowledge of circuit board miniaturization allows us to design and construct with proven reliability and manufacturability by extending the capabilities of traditional manufacturing equipment to higher tolerance levels.

MPMG meets your specific requirements for low-to-high volume military circuit card assembly in our ISO 9001:2001 registered manufacturing facility, as well as AS9100A for DoD, NASA and Aerospace Programs.

Microsemi Circuit Card Capabilities at a Glance

Microsemi Circuit Card Assembly Brochure