WEDC provides integrated silicon and advanced packaging solutions that suit the requirements of today's engineers. Our high reliability ceramic products are manufactured and tested in accordance with MIL-PRF-38534 Class H & Class K, and MIL-PRF-38535, created by DSCC to provide standardized fabrication, documentation and testing.
We have full design, fabrication and test capabilities for a wide variety of Multi-Chip Packages (MCPs), Commercial-Off-The-Shelf (COTS) memory, processors and combination MCPs for demanding applications. Additionally, our microelectronic products can be ruggedized and processed for tamper resistance.
Our products are a vital mode of solving key design challenges including:
- MCPs designed to compliment high performance memory controllers and memory device repackaing
- Advanced, high density semiconductor packaging reduces board space, power dissipation and design complexity issues while increasing operating speeds and extending product life
- A variety of memory configurations utilizing ceramic, hermetic packages and plastic encapsulated microcircuits and stacked die product
- Available for commercial, industrial and military temperature ranges
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