WEDC provides integrated silicon and advanced packaging solutions that suit the requirements of today's engineers. Our high reliability ceramic substrate products are manufactured and tested in accordance with MIL-PRF-38534 Class H & Class K, and MIL-PRF-38535, created by DSCC to provide standardized fabrication, documentation and testing.
We have full design, fabrication and test capabilities for a wide variety of
Multi-Chip Packages (MCPs) and custom multi-chip packages, Commercial-Off-The-Shelf (COTS) memory, processors and combination MCPs for demanding applications. Additionally, our microelectronic products can be ruggedized and processed to include
anti-tamper technology.
Our defense electronics products are a vital mode of solving key design challenges, including:
- Custom Multi-Chip Packages designed to complement high performance memory controllers and memory device repackaging
- Advanced, high density semiconductor packaging that reduces board space, power dissipation and design complexity issues while increasing operating speeds and extending product life
- A variety of memory configurations utilizing ceramic, hermetic packages and plastic encapsulated microcircuits and stacked die product
- Products suitable for industrial and military temp memory ranges
