Application-Specific Board Assembly

Our customer had three design requirements:

• Processing performance (density) that was constrained by system architecture
• Extended temperature operation
• Upgrade path for future technical refreshment

White Electronic Designs' semiconductor packages replaced ten SDRAM 60_FBGAs on this application specific board; the size of each being 10x12.5mm. These ten parts would have a total of 600 balls that would have needed to be routed. Our two semiconductor packages have a total of 416 balls - a 1/3 reduction in the I/O.

The total area of the 10 parts that we replaced was 1250mm²;our two BGAs only take up a total area of 704mm², for a space savings of 44%.