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Defense Electronics & Services

WEDC provides integrated silicon and advanced packaging solutions that suit the requirements of today's engineers. Our high reliability defense electronics products are manufactured and tested in accordance with MIL-PRF-38534 Class H & K, and MIL-PRF-38535, created by DSCC to provide standardized fabrication, documentation and testing.

Our products, from custom multi-chip packages to applications that meet military temp memory ranges, are a vital mode of solving key design challenges including:
  • MCPs designed to compliment high performance memory controllers
  • Advanced semiconductor packaging and memory device repackaging that leverages COTS technology to reduce board space, power dissipation and design complexity issues while increasing operating speeds and extending product life
  • A variety of memory configurations utilizing ceramic, hermetic packages and plastic encapsulated microcircuits
  • Available for industrial and military temp memory ranges

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