|
WEDC provides integrated silicon and advanced packaging solutions that suit the requirements of today's engineers. Our high reliability ceramic products are manufactured and tested in accordance with MIL-PRF-38534 Class H & Class K, and MIL-PRF-38535, created by DSCC to provide standardized fabrication, documentation and testing.
Our products are a vital mode of solving key design challenges including:
- MCPs designed to compliment high performance memory controllers
- Advanced semiconductor packaging reduces board space, power dissipation and design complexity issues while increasing operating speeds and extending product life
- A variety of memory configurations utilizing ceramic, hermetic packages and plastic encapsulated microcircuits
- Available for commercial, industrial and military temperature ranges
Review the Defense Microelectronics Product Catalog
|
|
|
