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WEDC provides integrated silicon and advanced packaging solutions that suit the requirements of today's engineers. Our high reliability products are manufactured and tested in accordance with MIL-PRF-38534 Class H & K, and MIL-PRF-38535, created by DSCC to provide standardized fabrication, documentation and testing.
Our products are a vital mode of solving key design challenges including:
- MCPs designed to compliment high performance memory controllers
- Advanced semiconductor packaging reduces board space, power dissipation and design complexity issues while increasing operating speeds and extending product life
- A variety of memory configurations utilizing ceramic, hermetic packages and plastic encapsulated microcircuits
- Available for industrial and military temperature ranges
Member of:
JEDEC
Review the Defense Electronics Product Catalog
Review the Defense Electronics Quick Reference Card
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