Defense & Aerospace Case Study

Application Specific Board

Customer requirements included:

Processing performance (density) that was constrained by system architecture
Extended temp
Upgrade path for future tech refresh.
Leaded balls for reliable long term interconnection. Much of the board area is made up of support circuitry: passives, power supplies, connectors etc.

Two Microsemi 256MByte 208BGA parts replaced ten 60-FBGAs on this board, each 10x12.5mm on a 1mm pitch.

These ten parts would have a total of 600 balls that need to be routed. The two Microsemi parts have a total of 416 balls – a one-third reduction in I/O; on a 1mm or 1.27mm pitch. The PCB was reduced from 14 to 12 layers.

Total area of the 10 parts would be 1250mm²….Two Microsemi 208 BGAs would be 572mm², for a space savings of over 50%. (Conservative)

All Microsemi parts are 100% burned-in and tested to military or industrial temps and are manufactured with 63/37 eutectic balls.

The 256MByte parts shown here can now be replaced with 512MByte or 1GByte parts in the same footprint from Microsemi.

Learn more about Key Application Benefits of PCB Density & Reduced Routing Complexity .