Our capabilities include: surface mount technology, ball grid array chip on board, flip chip as well as the integration of membrane and rubber keypad and enhanced liquid crystal display products, providing you with a complete solution. Our assembly floor and advanced equipment are specifically designed to support prototypes, pilot runs, high-mix boards and low-to-medium volume production quantities of electronic sub-assemblies or complete products.
Added capabilities for our compact flash cards include options such as conformal coating, custom labeling, and preinstalled images.
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