Chip On Board Assembly
WEDC has the equipment set, established and qualified processes, and the design and test teams to enable chip on board assembly. Combined with established relationships for bare die sourcing for DRAM, flash, FPGAs and other logic, the technology creates a formidable circuit card integration capability.
In chip on board assembly, the microchip or die is mounted directly to the circuit board instead of undergoing traditional assembly or packaging as an individual IC. The chip is attached to the substrate interposer and then functional connection is made via wirebonding or
flip chip . An encapsulated resin is deposited over the die to protect it against shock and for environmental protection. WEDC
anti-tamper technology can also be applied to delay access to the die and to prevent reverse engineering.
Chip on board assembly allows more functions to be integrated, thus driving greater functionality in embedded systems with limited board space. It provides layout flexibility that can be adapted to many components, minimizes stray capacitance and reduces inductance. WEDC’s ability to combine chip on board assembly with surface mount technology for cost effectiveness and yield results in a powerful solution set.
Primary benefits of chip on board assembly include:
- Size, weight and volume reduction
- Reduced trace length that improves signal performance
- Coatings applied directly to the silicon for tamper resistance
Please take a moment to read more information about WEDC assembly and manufacturing capabilities, including our
semiconductor packaging assembly capabilities .
