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Our heritage of technology excellence, innovation and leadership provide the foundation for our core competencies: - Sophisticated microelectronics and semiconductor packaging: We are one of the foremost experts and microelectronics partners in constructing extended environment, high-reliability, high-density semiconductor packages, including die stacking. We provide microelectronic and semiconductor packaging for mission-critical defense applications.
- High-density, high-reliability memory products: We design, manufacture and deliver high-density memory modules and PCMCIA cards. We provide full-service design, assembly and test module ruggedization with comprehensive risk mitigation for memory modules, and printed circuit board assembly. Our components provide customers with numerous advantages.
- Enhanced and ruggedized flat panel displays: We are a leading provider of enhanced active matrix liquid crystal display (AMLCD) solutions to expand the opportunities for flat panel display (FPD) utilization into non-traditional environments. Each of these solutions can be added to or modified on a display, enabling custom designs for unique requirements and applications.
- Intelligent human interface devices: We are known for business-driven innovation, advanced technology and the ability to develop and deliver a diverse collection of highly reliable and durable interface elements.
- Complete electromechanical assemblies: We develop and deliver interface devices and electromechanical assemblies that maximize our customers’ technology investment and minimize their risk. We can implement build to print requirements and design to specification projects.
We have the flexibility and ability to react quickly and be responsive at any stage of your product lifecycle.
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| AS/9100 Certification |
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Our manufacturing facilities conform with internationally accepted quality standards for defense and aerospace applications.
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