Our heritage of technology excellence, innovation within the defense electronics market and leadership provide the foundation for our core competencies:
- Sophisticated microelectronics and semiconductor packaging: We are one of the foremost experts and microelectronics partners in constructing extended environment, high-reliability, high-density semiconductor packages that leverage the advances of Commercial-Off-The-Shelf memory and technology, including die stacking. We provide microelectronic and semiconductor packaging for mission-critical defense applications.
- Complete electromechanical assemblies: We develop and deliver high-reliability interface devices and electromechanical assemblies that maximize our customers’ technology investment and minimize their risk. We can implement build to print requirements and design to specification projects.
We have the flexibility and ability to react quickly and be responsive at any stage of your defense electronics product lifecycle.
