Build to Print Services

Our electromechanical facility specializes in “turn-key” build to print (BTP) assemblies in which we procure or fabricate all components, assemble, and perform final functional testing. We provide BTP assemblies to support customer business needs, such as:

Many OEMs have legacy products that need to be maintained, even though they may not represent the current company growth products or represent a significant portion of their backlog. Subcontracting these legacy products to WEDC can reduce overhead costs, free up valuable resources, and allow the OEM to focus on skill sets required for growth products
The need for quality, competitive suppliers for existing build to print electromechanical assemblies
The need for suppliers to support new BTP product designs
The need for suppliers willing to provide “turn-key” build to print electromechanical assemblies.

Our BTP services include:

Circuit Card Assembly – Thru-hole, Surface Mount and BGA
Workmanship standards and acceptance criteria in conformance with IPC-A-610, Class II and III
Soldering workmanship and acceptance criteria in conformance with J-STD-001 Class II
Conformal Coating
Wire and cable harness assembly
Machining of metal and plastic components/housings
Finishing – Paint, passivate, iridite, black oxide
Precision mechanical and electronic assembly
Testing - Comprehensive final functional test, EPD designed and produced test equipment and environmental, including ESS (environmental stress screening).