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Key Application Benefits
PCB Density & Reduced Routing Complexity Applications Engineering Performance, Layout & Design Benefits to Customer
- This technology opens 20% to 70% of the available board real estate, and reduces memory down routing. This frees up real-estate for additional product features and can capture more sales opportunities for the board designer.
- Reduction of memory-down routing can save 2-4 PWB layers. In one example, going from a 24 layer board to 20 layers, which saved the customer ~$40.
- Improves parasitic performance (L, Z, C) at first and second level. Use of MCP provides reduced bus capacitance and better signal integrity on the PCB.
- Reduced memory-down routing can cut design time by up to ~4 weeks, and save the associated opportunity cost.
- Reduced routing allows wider pitch on BGA leads and hence easier class 3 PWB rule compliance since 0.5mm - 0.65mm pitch memory parts are not placed on the board.
- BOM maintenance costs are reduced since the MCM interface is consistent despite part obsolescence issues which are managed by the MCM vendor.
Environmental & Test Applications Engineering Extended Environment Performance
- Defense fielded weapons systems cannot survive with standard commercial temp parts.
- All Microsemi parts are 100% tested to mil-temp, industrial temp or customer specified temp ranges.
- All Microsemi parts are 100% burned in
- Shock, vibration, gun hardening.
- Standard parts are provided with SnPb leads.
Read about the key benefits of an Application Specific Case Study .
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