SRAM

WEDC’s family of Asynchronous SRAM based single and Multi-Chip Packages (MCPs) are designed to give our customers a high density memory solution that also meets the data widths necessary for their applications.

Starting at a density of 128MB (1Mb) in x8, x16 and x32 data width configurations these SRAM memories provide many benefits such as; high density, hermetic and non-hermetic packaging, surface mount and through-hole attachment types, space savings, and extended temperature range testing including industrial and military.