Application Notes

The following application notes contain instructions and/or recommendations on how to effectively utilize our sophisticated microelectronics and semiconductor packages, hi-performance memomy modules, rugged and enhanced LCD displays and intelligent interface devices.

Enhanced LCD Display Systems Application Notes
Display Filter Basics
Flat Panel Displays and Circular Polarization, High Performance Filters
Vacuum Fluorescent Displays
Vacuum Fluorescent Displays: Filter Mounting Suggestions


Application Notes

• SimScroll Reference Design   Reference design document for WEDC SimScroll Scroll Ring Interface
  
  
• PLL Based Design Advantages   The Advantages of PLL Based Design.
  
  
• W72M64V-XBX Flash   Discussion of basic operation of WEDC W72M64V-XBX Flash.
  
  
• Thermal Design Considerations   Basic discussion of WEDC thermal information for non-BGA products.
  
  
• PBGA Thermal Resistance Correlation   Discussion of the correllation of WEDC\'s thermal resistance models to actual thermal resistance measurements.
  
  
• Designing High Performance Systems Using WEDCs Registered SDRA   Discussion of design advantages of registered SDRAM MCPs.
  
  
• Manufacturing Flow for PBGA Products  
  
  
• Decoupling in High Speed Environments   Recommendations regarding decoupling in high speed environments.
  
  
• 2nd Level Interconnect Reliability Of Ceramic Area Array Package   Discussion of 2nd level reliability of CBGA package.
  
  
• SSRAM Overview   Discussion of various SSRAM types; advantages, disadvantages and typical application.
  
  
• Designing for Cost Effective Flip Chip Technology   Recommendations for wafer processing, redistribution, bump metallurgies, bump placement and flip chip assembly.
  
  
• Alpha Particle Considerations in Flip Chip Technology   Pertinent issues associated with soft errors, lead free solders, and reduction of alpha content in flip chip bumping.
  
  
• G2T - G2L CQFP Package Comparison   Package comparison of G2T and G2L CQFP package types.
  
  
• G2U to G1U Package Comparison   Package comparision based on CQFP package change from G2U to G1U Package Comparison.
  
  
• G2T to G2U Package comparision   Package comparision based on CQFP package G2T to G2U type.
  
  
• Flash Memory Operation 1M5   Discussion of basic operation of all WEDC Flash products using 1Mb 5V Flash die.
  
  
• Flash Memory Operation 4M5   Discussion of basic operation of all WEDC Flash products using 4Mb 5V Flash die.
  
  
• Flash Memory Operation 8M3   Discussion of basic operation of all WEDC Flash products using 8Mb 3.3V Flash die.
  
  
• Flash Memory Operation 16M5   Discussion of basic operation of all WEDC Flash products using 16Mb 5V Flash die.