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Application Notes
The following application notes contain instructions and/or recommendations on how to effectively utilize our sophisticated defense electronics, and hi-performance memomy modules.
Application Notes
PLL Based Design Advantages
The Advantages of PLL Based Design.
W72M64V-XBX Flash
Discussion of basic operation of Microsemi's W72M64V-XBX Flash.
Thermal Design Considerations
Basic discussion of Microsemi thermal information for non-BGA products.
PBGA Thermal Resistance Correlation
Discussion of the correllation of Microsemi's thermal resistance models to actual thermal resistance measurements.
High Performance System Design with Registered SDRAM MCPs
Discussion of design advantages of registered SDRAM MCPs.
Manufacturing Flow for PBGAs
Decoupling in High Speed Environments
Recommendations regarding decoupling in high speed environments.
Designing for Cost Effective Flip Chip Technology
Recommendations for wafer processing, redistribution, bump metallurgies, bump placement and flip chip assembly.
Alpha Particle Considerations in Flip Chip Technology
Pertinent issues associated with soft errors, lead free solders, and reduction of alpha content in flip chip bumping.
G2T - G2L CQFP Package Comparison
Package comparison of G2T and G2L CQFP package types.
G2U to G1U Package Comparison
Package comparision based on CQFP package change from G2U to G1U Package Comparison.
G2T to G2U Package Comparison
Package comparision based on CQFP package G2T to G2U type.
Flash Memory Operation 1M5
Discussion of basic operation of all Microsemi Flash products using 1Mb 5V Flash die.
Flash Memory Operation 4M5
Discussion of basic operation of all Microsemi Flash products using 4Mb 5V Flash die.
Flash Memory Operation 8M3
Discussion of basic operation of all Microsemi Flash products using 8Mb 3.3V Flash die.
Flash Memory Operation 16M5
Discussion of basic operation of all Microsemi Flash products using 16Mb 5V Flash die.
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