Application Notes

The following application notes contain instructions and/or recommendations on how to effectively utilize our sophisticated defense electronics, and hi-performance memomy modules.

Application Notes

PLL Based Design Advantages The Advantages of PLL Based Design.
W72M64V-XBX Flash Discussion of basic operation of WEDC W72M64V-XBX Flash.
Thermal Design Considerations Basic discussion of WEDC thermal information for non-BGA products.
PBGA Thermal Resistance Correlation Discussion of the correllation of WEDC\'s thermal resistance models to actual thermal resistance measurements.
Designing High Performance Systems Using WEDCs Registered SDRA Discussion of design advantages of registered SDRAM MCPs.
Manufacturing Flow for PBGAs
Decoupling in High Speed Environments Recommendations regarding decoupling in high speed environments.
Designing for Cost Effective Flip Chip Technology Recommendations for wafer processing, redistribution, bump metallurgies, bump placement and flip chip assembly.
Alpha Particle Considerations in Flip Chip Technology Pertinent issues associated with soft errors, lead free solders, and reduction of alpha content in flip chip bumping.
G2T - G2L CQFP Package Comparison Package comparison of G2T and G2L CQFP package types.
G2U to G1U Package Comparison Package comparision based on CQFP package change from G2U to G1U Package Comparison.
G2T to G2U Package Comparison Package comparision based on CQFP package G2T to G2U type.
Flash Memory Operation 1M5 Discussion of basic operation of all WEDC Flash products using 1Mb 5V Flash die.
Flash Memory Operation 4M5 Discussion of basic operation of all WEDC Flash products using 4Mb 5V Flash die.
Flash Memory Operation 8M3 Discussion of basic operation of all WEDC Flash products using 8Mb 3.3V Flash die.
Flash Memory Operation 16M5 Discussion of basic operation of all WEDC Flash products using 16Mb 5V Flash die.