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WEDC designs, develops and markets chip level hardware solutions which delay or obfuscate chip level attacks and mitigate reverse engineering and IP theft. We work with defense prime contractors in a DoD secure facility to provide tamper resistant technologies and processes that challenge the analysis of chips in monolithic or multichip module packages, and provide security solutions for defense platforms and systems.
Sophisticated attack methodologies on ASICs, processors, memories and gate arrays can leave high-value semiconductor technologies open to reverse engineering, code lifting or IP theft. WEDC's die package resident techniques contribute to the multi-level protection and tamper resistance needed to slow the loss of these critical technologies.
WEDC's security technologies are easy and cost effective to implement, with little impact on system performance, while protecting DoD critical technologies and helping to enable foreign military sales.
For information on tamper resistant technology, please contact the factory at 602-437-1520 (ext. 128).
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| AS/9100 Certification |
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Our manufacturing facilities conform with internationally accepted quality standards for defense and aerospace applications.
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